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Research

“Where Hybrid Integration Meets Genuine Hyper-functionality”
HIGH Lab은 차세대 디스플레이, 메모리, 보안 기술을 융합하여, 더 스마트하고 지속 가능한 미래를 설계합니다.

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📌 Division 1:

DISPLAY APPLICATIONS

This division aims to address various reliability issues in display panels and develop next-generation display and sensor technologies. The research focuses on emerging systems and materials such as OLEDoS, LTPO, 1D/2D/3D TFTs, Metal Halides, and Perovskites to enhance high-performance device applications.

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📌 Division 2:

NEXT-GENERATION MEMORY & 3D INTEGRATION

This division focuses on developing next-generation non-volatile memory (RRAM), ferroelectric memory, and photo-detector-based computing and storage technologies. By utilizing Through-Silicon Via (TSV) and TGV(Through-Glass Via) technologies, the aim is to maximize device integration density.

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📌 Division 3:

CYBER-SECURITY & SUSTAINABLE ELECTRONICS

This division focuses on developing zero-waste transient electronic systems and bio-implantable security technologies. The goal is to establish brain hacking prevention and cyber-security solutions for the next-generation electronic era.

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1. Display Applications

✅ Next-Generation Display & Sensor Technologies

  • OLEDoS (OLED on Silicon) and LTPO display technology research

  • 1D/2D/3D TFTs & Photodetectors

    • Development of display sensors based on low-dimensional semiconductors (1D, 2D), Metal Halides, and Perovskites

    • Performance enhancement of TFTs using Silicon membranes and III-V semiconductors

✅ Device Reliability & Modeling

  • TFT performance improvement and 1/f noise analysis for reliability assessment

  • SPICE model development & TFT modeling for high-performance display circuit design

✅ Light-to-Frequency (LTF) Conversion for In-Situ Monitoring

  • Diagnostic techniques for real-time issue detection and resolution in display panels

  • Development of in-situ panel monitoring systems

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2. Next-Generation Memory & 3D Integration

✅ Next-Generation Non-Volatile Memory Research

  • RRAM (Resistive RAM) and 2T-0C structures

  • HZO-based ferroelectric memory

✅ Photo-Responsive Memory & Advanced Devices

  • Photo-Detector & MOSFET-based optoelectronic memory

  • Multi-stacking memory architectures

✅ TSV/GSV-Based 3D Integration Technologies

  • Implementation of high-density stacked devices using TSV and GSV

  • Crossbar array architectures for neuromorphic computing

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3. Cyber-Security & Sustainable Electronics

✅ Cyber-Security & PUF-Based Authentication

  • Physical Unclonable Function (PUF)-based security technology development

  • Secure transient electronics applications

✅ Sustainable Energy & Eco-Friendly Devices

  • Micro-supercapacitor & environmentally friendly battery research

  • Integration of display and memory devices for sustainable electronics

✅ Brain Hacking Prevention & Polar Region Applications

  • Development of implantable LC oscillator-based security technologies

    • Eliminating brain hacking threats through novel electronic security techniques

  • MULTIMODAL sensor-based applications in polar regions for Snow accumulation monitoring systems in extreme environments

26, Kyungheedae-ro 6-gil, Dongdaemun-gu, Seoul, Republic of Korea

jinsh@khu.ac.kr

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